Request InfoSemiconductor Equipment Corp.The model 860 Omni laser diode bonder is suitable for use with vertical-cavity surface-emitting lasers, edge-emitting laser diodes and laser bars and arrays. Semiconductor Equipment Corp. says it aligns and attaches die at a throughput rate of 140 per hour with an accuracy of ±5 µm. The platform has an extend-retract cube beamsplitter viewing system with illuminators, a stereozoom microscope on a pivoting mount and servomotor-driven Z motion with closed-loop temperature control.See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra July 2022 IssueFluorescence Filter SetKnight Optical LLC’s fluorescence filter set range suits the diverse needs of various fluorescence applications that demand high-quality components. 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