Search
Menu
Cognex Corp. - Smart Sensor 3-24 GIF LB

LASER DIODE BONDER

Facebook X LinkedIn Email
Request Info
Semiconductor Equipment Corp.
The model 860 Omni laser diode bonder is suitable for use with vertical-cavity surface-emitting lasers, edge-emitting laser diodes and laser bars and arrays. Semiconductor Equipment Corp. says it aligns and attaches die at a throughput rate of 140 per hour with an accuracy of ±5 µm. The platform has an extend-retract cube beamsplitter viewing system with illuminators, a stereozoom microscope on a pivoting mount and servomotor-driven Z motion with closed-loop temperature control.See full product

Related content from Photonics Media



    PRODUCTS


    ARTICLES


    PHOTONICS HANDBOOK ARTICLES


    WHITEPAPERS


    WEBINARS


    PHOTONICS DICTIONARY+ TERMS


    VIDEOS


    PHOTONICS BUYERS' GUIDE CATEGORIES


    COMPANIES


    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.