Request InfoRemtec Inc.Remtec Inc. says it has improved its PowerPlug technology, which consists of thermal via fills for use in the fabrication of metallized ceramic substrates, chip carriers and packages. The company says that these solid, copper-plated vias improve the performance of microelectronic circuitry. They provide a uniform thermal environment and allow designers to reduce package size and increase integration level and circuit density. Features include thermal resistance as low as 2 °C/W, high thermal conductivity and an electrical resistance as low as 0.38 mV.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 3/7/2019In Vivo Medical Laser Procedures: An OverviewThis webinar, presented by OFS, will provide an overview of current in vivo medical procedures performed using lasers and optical fibers. The presentation will begin with a brief history of...Photonics.com 1/12/2023A Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation WorkforceWith the passage of the CHIPS and Science Act and growing demand for photonic integrated circuit technology, the semiconductor industry is once again gaining momentum. But even as the U.S. rebuilds...Photonics.com 1/18/2018Fiberguide RARe Motheye Fiber: Random Anti-Reflective (RARe) Nanostructures on Optical Fibers as Replacement for AR CoatingsAnti-reflective (AR) coatings are now entering their second century and have remained virtually unchanged throughout their life. As power level and wavelength range requirements continue to increase,...Photonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...