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  • DALSA Receives Digital Camera Contract
Sep 2003
WATERLOO, Ontario, Sept. 24 -- DALSA Corp. announced it has received a $1.9 million camera development contract from a leading manufacturer of semiconductor wafer inspection systems.

DALSA will produce high-performance digital cameras that will be used to inspect semiconductor wafers at extremely high speeds and low light levels. The cameras will be the "electronic eyes" for inspection systems.

DALSA said the order is its third camera development contract from a semiconductor equipment manufacturer this year.

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