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Alluxa - Optical Coatings LB 8/23

Semiconductor Inspection Moves to Deep-UV Imaging

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High-speed camera architectures and multiport CCDs enable the required data rates and dynamic range.

Dr. John R. Tower, Sarnoff Corp.

Fueled by the ever-decreasing size of features on semiconductor wafers, the semiconductor inspection industry continues to focus on shorter-wavelength light (Figure 1). Increasingly, the manufacturers of wafer and reticle (photomask) inspection tools and defect-review imaging technology are developing systems that are based on illumination sources, optics and cameras that operate in the deep-UV, 150 to 300 nm. Wavelengths of interest include 248, 193 and 157 nm (excimer laser wavelengths). Figure 1. The resolution improvement afforded by imaging at shorter wavelengths is driving more...Read full article

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    Published: July 2004
    Basic SciencecamerasCoatingsFeaturesillumination sourcesindustrialOpticsreticle inspection toolssemiconductor wafersSensors & DetectorsWafers

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