ST, IBM Pool Chip Efforts
GENEVA and ARMONK, N.Y., July 26, 2007 -- Semiconductor maker STMicroelectronics (ST) and IBM said they will collaborate to develop next-generation process technology -- the "recipe" used in semiconductor development and manufacturing. Financial terms were not disclosed.
The agreement includes 32- and 22-nm CMOS process technology development, design enablement and advanced research adapted to the manufacturing of 300-mm silicon wafers. It includes both the core bulk CMOS technology and value-added derivative system-on-chip (SoC) technologies, and "positions both companies at the leading edge of technology development," the companies said. They will also collaborate on IP development and platforms to speed the design of SoC devices.
Each company will establish a technical development team at the other's facility. For bulk CMOS development, ST will establish a research and development team in IBM's Semiconductor Research and Development Center in East Fishkill and Albany, N.Y.; and IBM will establish a research and development team at ST's 300-mm wafer semiconductor R&D and fabrication facility in Crolles, France -- where they will jointly develop technologies such as embedded memory and analog/radio frequency, for consumer and server markets and in wireless applications such as cell phones and global positioning devices.
"ST will join a partnership of semiconductor manufacturing, development and technology companies who collaborate to address the design complexity and advanced process development necessary for producing smaller, faster, more cost efficient semiconductors," the companies said in a stament. "Members in this six-company development network -- known as the IBM CMOS technology alliance -- benefit from early access to technology, the ability to drive technology definition, the combined research and development resources for problem solving and access to a common manufacturing base."
IBM and ST will work together to expand the network at ST's fab in France to include other members of IBM's CMOS technology alliance who are interested in developing value-added derivative SoC technologies, the companies said.
"The addition of STMicroelectronics to the IBM technology alliance continues to strengthen our ability to address the semiconductor industry's technical and economic challenges inherent in developing advanced technologies," said John E. Kelly III, senior vice president, IBM Research. "Our joint expertise and cooperative efforts with ST will help enhance process development efforts while also delivering faster time to market and greater technology advantage to our clients."
Volume production will take place at ST's Crolles facility and in other alliance members' 300-mm facilities, including IBM's.
IBM and ST said they also plan to work with the CEA-LETI (Grenoble, France) research institute in Grenoble, France, to develop "advanced topics for future technology nodes."
For more information, visit: ibm.com/chips or st.com
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