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Dan Hillman Named Engineering VP at Transmeta

Photonics.com
Jan 2008
Transmeta Corp. of Santa Clara, Calif., a developer of computer, microprocessor and semiconductor technologies, announced that Dan Hillman has joined its executive team as vice president of engineering. "Dan brings to Transmeta over 35 years of experience across a variety of sectors including IP (intellectual property) licensing, chip design, and electronic design automation (EDA), all of which are applicable to Transmeta as we work to promote the adoption of our LongRun2 technologies by a broader market," said President and CEO Les Crudele. Most recently, Hillman served as vice president of engineering for Mosaid Technology, a position he previously held at Virtual Silicon, acquired by Mosaid in 2005. Before that, he served as vice president of engineering for inSilicon, a provider of communications semiconductor IP, which was acquired by Synopsys. Hillman also served as Corporate Application Group director for the Physical Synthesis business unit of Synopsys for eight years and spent 11 years at Apple Computer as a hardware manager, where he was directly involved in the design of the Apple IIGS and Macintosh computers and also led a team that developed the IEEE 1394 (Firewire) serial bus. Hillman began his career at RCA and Zilog and holds a BS in electrical engineering from Purdue University.


GLOSSARY
chip
1. A localized fracture at the end of a cleaved optical fiber or on a glass surface. 2. An integrated circuit.
photonics
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
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