Glass Structuring Agreement
MSG Lithoglas AG of Berlin has signed an agreement with Schott AG of Mainz, Germany, for exclusive use of the latter’s process and application intellectual property on the additive structuring of glass. This technology enables the deposition of thin borosilicate glass layers at low temperatures and allows for hermetic packaging on the wafer level – yielding reliable, robust and biocompatible passivation at low cost.
- A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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