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  • ESI Buys XSiL IP
May 2009
PORTLAND, Ore., May 13, 2009 -- Electro Scientific Industries Inc., a provider of photonic and laser systems for microengineering applications, announced Tuesday that it has purchased all intellectual property (IP) rights, some hardware, and software components from XSiL Ltd. of Dublin, Ireland, for an undisclosed price.

XSiL provided high-yield process solutions that improved die break strength and throughput for semiconductor wafer singulation applications. The agreement became effective during ESI's fiscal 2009 fourth quarter, the company said.

“We plan to combine XSiL's technology IP with our Cignis [semiconductor processing] platform in order to accelerate our entry into the thin wafer laser dicing market," said Nick Konidaris, president and CEO of ESI. “There is a growing demand for a laser-based process that can singulate thin silicon wafers, driven by the need to integrate more memory and functionality into mobile devices."

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The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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