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Wafer Bonding Shipment

Photonics Spectra
Apr 2010
Wafer bonding and lithography equipment supplier EV Group of St. Florian, Austria, has shipped two wafer bonding systems to the University of Michigan’s Lurie Nanofabrication Facility, a center for microelectromechanical systems (MEMS) and microsystems research and a member of the National Nanotechnology Infrastructure Network. The new systems will provide high-force wafer bonding capabilities to increase the level of the university’s MEMS research efforts.

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