Ultratech Ships First Sub-20-nm Ambient Control System
SAN JOSE, Calif., June 20, 2013 — Lithography and laser-processing systems supplier Ultratech Inc. has shipped its first LSA201 ambient control laser spike anneal system to an undisclosed company for the development of FinFET logic technology.
The LSA201 system is built on a customizable Unity platform and includes a patented microchamber design that enables precise control over gases that surround wafers during processing. The current instrument is capable of running mixtures of any inert gases, but the microchamber architecture is extendable to more reactive gases for future processes. The device is suitable for interface engineering and film property modification where ambient control is critical at sub-20 nm.
“As devices scale below 20 nm, there are an increasing number of applications beyond dopant activation which involve interface engineering or film modification, such as advanced silicide formation and high K anneal,” said Dr. Jeff Hebb, vice president of laser product marketing. “Precise control of the wafer ambient is required for these kinds of processes, and the LSA201 delivers this capability. As more of these types of processes are incorporated into leading-edge device flows, we expect the LSA201 to become our flagship product.”
Volume shipment of the platform will begin in the second half of 2013.
For more information, visit: www.ultratech.com