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  • 3D-Micromac Opens US Headquarters
Jul 2016
CHEMNITZ, Germany, July 12, 2016 — 3D-Micromac AG is expanding its global presence with the opening of its new American headquarters in San Jose, Calif. Serving as both an applications lab and sales and support facility, the office marks the company's first major presence in North America.

The company said it is expanding to meet demand for its laser micromachining products across all of its served markets, including solar, semiconductor, microelectromechanical, display and smart glass.

A two-electrode device with an anode and a cathode that passes current in only one direction. It may be designed as an electron tube or as a semiconductor device.
A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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