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DataRay Inc. - ISO 11146-Compliant Laser Beam Profilers

Manufacturers Release Common Specifications for Optical Devices

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A group of optical chip and module manufacturers has released common specifications for optical devices based on a 10-Gb/s Miniature Device multisource agreement. The specifications are intended for devices capable of transmission over at least 20 km. The agreement enables the use of devices from multiple suppliers and was created to establish compatible sources of 10-Gb/s transmitter and receiver optical subassemblies embedded in the 10-Gb/s Small Form Factor Pluggable mul-tisource agreement module, which was designed for use in large-capacity network and storage systems. The latter agreement covers devices that comply with interface standards such as 10 Gigabit Ethernet, Fibre Channel and SONET OC-192.
The participating manufacturers are Eudyna Devices Inc. of Yokohama and Sumitomo Electric Industries Ltd. of Osaka, both in Japan; Opnext Inc. of Eatontown, N.J.; and Mitsubishi Electric Corp. and Oki Electric Industry Co. Ltd., both of Tokyo.
Alluxa - Optical Coatings MR 8/23

Published: August 2004
Businesslight speedmodule manufactureroptical chipsoptical devicesoptical subassembliesSumitomo Electric Industries Ltd.

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