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< Optics & Optical Fabrication
< Optical Fabrication Accessories
Polishing Material and Pads
11 products
Optical Fabrication Accessories: Polishing Material and Pads
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HASTILITE MOV 850
Universal Photonics Inc.
Type:
Polishing Material and Pads
Density (g/mL):
1.4 - 1.6
Particle Size D50 (μm):
0.3 - 0.5
Particle Size D99 (μm):
< 2
Premier Product
UNICER 1000 Cerium Polish
Universal Photonics Inc.
Type:
Polishing Material and Pads
Appearance:
Off White, Powder
Cerium Oxide Content (%):
≥ 58
Particle Size D50 (μm):
0.8 - 2.0
SC-955 PAD
Universal Photonics Inc.
Type:
Polishing Material and Pads
Density (g/cm3):
0.30 - 0.42
PSA Backing:
Yes
Removal Rate (µm/min):
0.68
HASTILITE Poly Silicon Polish
Universal Photonics Inc.
Type:
Polishing Material and Pads
Particle Size D50 (µm):
0.110 - 0.140
Particle Size D99 (µm):
< 0.389
pH:
1 - 3
HASTILITE Nano Silicon Polish
Universal Photonics Inc.
Type:
Polishing Material and Pads
% Solids:
15 - 20
Particle Size D50 (μm):
0.110 - 0.140
Particle Size D99 (μm):
< 0.389
HASTILITE Ceria-Base Polish
Universal Photonics Inc.
Type:
Polishing Material and Pads
Particle Count D50 (μm):
0.4 - 0.7
pH:
6 - 7
PO Density (g/mL):
1.50 - 1.68
TJX438 Ceria Slurry
Demeter Technologies Inc.
Type:
Polishing Material and Pads
Concentration:
30%
D50 (µm):
0.5 - 0.7
D97:
<4.0
TPJ825 Ceria Powder
Demeter Technologies Inc.
Type:
Polishing Material and Pads
CeO2/TREO:
>60%
Concentration:
100%
D50 (µm):
1.2 - 1.6
TJP621 Ceria Powder
Demeter Technologies Inc.
Type:
Polishing Material and Pads
CeO2:
65-72 %
Concentration:
100%
D50 (µm):
1.8 - 2.2
DZr-P Zirconia Slurry
Demeter Technologies Inc.
Type:
Polishing Material and Pads
Color:
Pink
Concentration:
25%
D50 (µm):
1.4 - 1.6
D605S Ceria Slurry
Demeter Technologies Inc.
Type:
Polishing Material and Pads
Concentration:
50%
D50 (µm):
0.8 - 1.0
D97:
5.0
Optical Fabrication Accessories: Polishing Material and Pads Products
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