Jun 2002GT Advanced TechnologiesRequest Info
Crystal Systems' fixed abrasive slicing technology uses a pack of wires with diamond particles to slice silicon, sapphire, silicon carbide and other materials that require precise fabrication. For example, this technique can be used to slice sapphire wafers for light-emitting diodes. The slicers can rotate workpieces at speeds of up to 5000 rpm. The company says this technology provides high wafer accuracy, low kerf loss, low damage, and cutting rates that are three times higher than those achieved by other methods.