Request InfoMKS/NewportThe MRSI-5005 advanced packaging work cell is offered by Newport Corp. This packaging system combines GaAs die handling and flip-chip bonding for component attachment applications with MEMS and with RF, microwave and millimeter-wave modules. It also is suitable for thermal compression flip bonding. Features include placement accuracy of ±5 µm, 360° random die orientation, substrate alignment, programmable controlled force and automatic tip changing. The MRSI-5005 accepts parts in cassette-to-cassette handling mode, wafer pickup, waffle and gel packs, and tape feeders.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...Photonics.com 1/9/2023Innovations in Ultrashort-Pulse and RF-Excited CO2 Lasers Expand Materials Processing ApplicationsIndustrial laser materials processing is constantly evolving. Industries as varied as pharmaceutical, consumer electronics, automotive, aerospace, and textiles, among others, have benefited from new...Photonics.com 7/20/2023Motorized and Calibrated Lenses for Machine Vision ApplicationsMany applications have benefited from motorized varifocal lenses that allow automatic or remote adjustment of focus distance and field of view. Applications may need to change the focal length or...Photonics.com 7/22/2021STANDARDS UPDATE: Vision Standards: An Overview of Global and A3 DevelopmentsStandards play a key role in the vision and imaging industry by ensuring interoperability of components, increasing market size, and shortening the time it takes to get new products to market. As the...