The Model 5430 UV laser microvia drill system from Electro Scientific Industries Inc. is suitable for high-volume integrated circuit packaging. It incorporates high-power diode-pumped lasers with repetition rates up to 70 kHz for high throughput. It features the company's optional shaped beam technology for performing ablation of nonreinforced dielectric and solder mask material. The UV laser's short pulse width can generate via diameters as small as 25 µm. Model 5430 is designed to allow lasers, optical components or galvanometers to be replaced on site.