For real-time trench-thickness measurement from a few angstroms to hundreds of microns, Jobin Yvon Inc. has announced the TDM 200. It can be used for deep or shallow trenches on any kind of substrate, and measures absolute depth for MEMS dry etching applications. Based on a patented twin-spot interferometric camera, it measures from the phase shift that is generated between two laser spots, one on the mask and the other on the trench. An integrated CCD camera enables easy positioning of the two laser spots on the substrate, and a software interface provides immediate readout of etch depth.
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