White micro side LEDs that measure 0.8 mm high and that feature electrostatic discharge protection have been launched by Osram Opto Semiconductors. Applications for the surface-mount modules include displays on small mobile terminals, such as phones, PDAs and handheld devices. The InGaN-based chip is manufactured using thin-film technology. With an operating current of 20 mA, the micro side LEDs produce 800 millicandela. In these next-generation devices, silicone has replaced epoxy resin as the encapsulation material. The company says that it ages more slowly and that it increases LED life by a factor of 10.