Nov 2005Master Bond Inc.Request Info
Master Bond Inc. has announced EP30, a two-component epoxy for high-performance bonding applications. The low-viscosity adhesive provides high bonding strength even when cured at ambient temperatures, but application of moderate heat accelerates the cure. The company says that the substance has outstanding chemical resistance, dimensional stability, hardness and optical clarity and that its electrical insulation properties withstand prolonged exposure to moisture. The epoxy is suitable for potting and encapsulating electronic components as well as for bonding optical elements. It adheres to a variety of substrates, including metals, ceramics, glass and many plastics.