Apr 2006TT ElectronicsRequest Info
TT electronics’ IRC Advanced Film Div. has developed an anodized aluminum alloy substrate material with high thermal conductivity to address the problem of heat dissipation in direct-mounted LED arrays. Design engineers can mount multiple visible LEDs and other components directly to the heat-conducting Anotherm substrate, eliminating the need for attached heat sinks and mounting hardware. Solderable thick-film conductors can be screen-printed to the substrate to connect surface-mount packaged components and wire-bonded die. The substrate can operate at up to 400 °C without soldered components and at up to 175 °C using high-temperature solder. Maximum operating voltage is 250 VAC, and thermal impedance is characterized at 0.2 °C/W.