TT electronics’ IRC Advanced Film Div. has developed an anodized aluminum alloy substrate material with high thermal conductivity to address the problem of heat dissipation in direct-mounted LED arrays. Design engineers can mount multiple visible LEDs and other components directly to the heat-conducting Anotherm substrate, eliminating the need for attached heat sinks and mounting hardware. Solderable thick-film conductors can be screen-printed to the substrate to connect surface-mount packaged components and wire-bonded die. The substrate can operate at up to 400 °C without soldered components and at up to 175 °C using high-temperature solder. Maximum operating voltage is 250 VAC, and thermal impedance is characterized at 0.2 °C/W.