Fonon Technology International Inc. announces a laser scribing system for the flat panel display industry. Its new generation of laser equipment for cutting glass and other brittle materials for electronics and semiconductors uses the FantomT GX product line and a new method called zero width laser cutting technologyT (ZWCTT), which splits the materials on the molecular level at very high speeds. This produces no particles, residue or material loss. The scribe line is formed so that molecules do not leave the surface of the glass, eliminating the chips or debris associated with conventional scribe and break technologies. ZWCTT incorporates controlled heating followed by cooling of the glass surface to create the intermolecular separation of the glass substrate. The laser system can achieve cutting speeds of ∼500 mm/s.