Request InfoSUSS MicroTec Inc.WATERBURY CENTER, Vt., July 24, 2006 -- Suss MicroTec, a supplier of precision manufacturing and test equipment to the semiconductor industry, has introduced M-Lock, a wafer-bonding system designed for high vacuum applications. In what the company said is an industry-first, this field-upgradeable, load-locked wafer-bonding system was developed by Suss MicroTec for advanced MEMS (microelectromechanical systems) devices that require ultraclean, low moisture and low contamination vacuum bonding. In addition, M-Lock is well suited for MEMS devices with on-chip getters, such as silicon gyros and other advanced MEMS products, the...See full productRelated content from Photonics MediaPRODUCTSPhotonics Spectra December 2023 IssueMEMS Autofocus ActuatorThe MEMS Autofocus Actuator for Active Athermalization in Embedded Vision Cameras from Sheba Microsystems Inc. was made to be used in automotive, action, drones, machine vision, security and...Vision Spectra Autumn 2023 IssueRobotic Bin Picking SoftwareThe Version 1.0 release of the CapSen PiC software from CapSen Robotics combines 3D vision, motion planning, and control algorithms to give robots the ability to locate, pick, and manipulate objects...Vision Spectra Autumn 2022 IssueEVK HD 4The EVK HD 4 Event-based Vision Evaluation Kit from Prophesee is based on the Sony IMX636ES high-definition sensor. 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