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WAFER PROCESSING

Photonics Spectra
Sep 2006
IPG Photonics, Microsystems Div.Request Info
 
J.P. Sercel Associates (JPSA) has introduced its compact IX-200 UV laser wafer processing and micromachining systems, which are suitable for front- and back-end materials processing. The ChromaDice is a diode-pumped solid-state version that performs high-speed wafer dicing and cutting with typical yields of >99%. The Class 1 fully enclosed system is available in 266- or 355-nm wavelengths and can make cuts as narrow as 2.5 μm. The ChromAblate excimer laser configuration model at 248 nm is suitable for micromachining silicon, GaN, GaAs, polymers and ceramics. An optional 193-nm version also is available.


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