CupraPlus Copper Capillary
Dec 2006Kulicke & Soffa Industries Inc.Request Info
FORT WASHINGTON, Pa., Dec. 13, 2006 -- Expanding on the capabilities of its Cupra copper capillary, Kulicke & Soffa Industries Inc. (K&S) has developed the CupraPlus, which it said supports highly consistent and stable fine-wire second bonds while maintaining the quality of the overall wire-bonding process.
“The formation of a fine-wire second bond in fine copper wire bonding has been a constant obstacle, mainly due to frequent tail bond failures, inconsistent second bond strength and an unstable bonding process window,” said Jack Belani, vice president of the marketing and business units at K&S. “With its unique design and properties, the CupraPlus copper capillary provides for increased second-bond pull strength for a more stable and consistent quality bond throughout a process.”
To meet different wire bonding challenges, the CupraPlus can handle copper wire from 0.8 mil to 3.0 thicknesses.
For more information, visit: www.kns.com; e-mail: firstname.lastname@example.org
Kulicke & Soffa Industries
1005 Virginia Drive
Fort Washington PA 19034
Phone: (215) 784-6000
Fax: (215) 784-6001