Request InfoSUSS MicroTec SEGARCHING, Germany, May 3, 2007 -- With the DSM200, microelectronics and test systems maker Suss MicroTec AG said it has developed an automated metrology system for all emerging front-to-back alignment applications. According to the company, the cassette-cassette, front-to-back alignment metrology system is the ideal tool for verifying alignment accuracy on wafers from 2 in. to 200 mm. Incorporating state-of-the-art pattern recognition technology, the DSM200 offers the highest measurement accuracy of 0.2 µm at 3 σ on a fully automated platform with minimized operator intervention. 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