The InfraSight MI thermal imaging camera has been announced by OptoTherm Inc. It detects shorts and defects on semiconductor devices and on small circuit boards, measures junction temperature, identifies die bonding defects and measures packaged die thermal resistance. Temperature measurement range is from 0 to 300 °C, with accuracy of ±2%. The camera operates at a rate of 30 fps and has a 16-bit digital Camera Link interface. The microscopic lens delivers 20-μm-pixel spatial resolution and sensitivity of 0.3 °C. It has a field of view of 17° × 12° and a focus distance of 13 mm.