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COLD PLATE

Photonics Spectra
Apr 2008
Elite Thermal Engineering LLCRequest Info
 
EliteThermalEngineering.jpgThe OCP-110 introduced by Elite Thermal Engineering is a thermoelectric cold plate for fiber laser OEM or laboratory cooling applications. It provides 110 W of cooling capacity when the set temperature is the same as ambient, and the set temperature can be 48 °C below ambient when the heat load is zero. The system is side-cooled by ducting air through high-density heat sinks. All of its thermoelectric coolers are environmentally sealed so that it can operate reliably at below dew point set temperatures. The company says that the copper cold plate provides much lower spreading resistance than cold plates made of aluminum. The device is designed to temperature-stabilize the most popular fiber-coupled laser diodes and has mounting patterns that can accommodate devices made by QPC Lasers Inc., Limo GmbH and nLight Corp. A high-quality screw terminal block facilitates connection.



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