Oct 2008Master Bond Inc.Request Info
Master Bond Inc. has introduced a low-viscosity epoxy adhesive for room-temperature-curing bonding applications that is fast. The adhesive EP41SMED has a 5:1 mix ratio by weight and a handling time of as little as 10 to 15 min at ambient temperatures. It offers low shrinkage upon cure and contains no solvents or diluents. The rigid bonds are resistant to water, oil, cold sterilants, gamma radiation and many organic solvents, and they adhere to metals, glass, ceramics, rubber, wood and most plastics.