THERMAL IMAGING CAMERA
Jan 2009Optotherm Inc.Request Info
The latest version of OptoTherm Inc.’s Micro thermal imaging system for semiconductor failure analysis includes a new camera with a 320 × 240-element uncooled detector, 0.05 °C sensitivity, a 20-μm microscopic lens, a wide-angle lens and a 16-bit digital Camera Link interface. The system measures and displays the temperature distribution over the surface of semiconductor devices for detection of hot spots. It also calculates thermal resistance, measures junction temperature and identifies die bond defects.