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FAST-CURING ADHESIVE

Photonics Spectra
Mar 1997
Master Bond Inc.Request Info
 
Master Bond Inc. has developed a two-part, silver-filled, electrically conductive adhesive that cures rapidly at room temperature. The Model EP77M-F compound has a one-to-one mix ratio and can set up in ambient temperatures within 5 to 7 min, even when mixed in very small amounts. It features a high bond strength of 1500 psi tensile shear when fully cured at room temperature. The adhesive does not contain any diluents or solvents, and bonds are resistant to oil, water and most organic solvents.


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