HENLEY-ON-THAMES, England, May 17, 2010 — Engis (UK) Ltd. has unveiled a benchtop four-way, double-sided lapping and polishing machine, suited to research applications and short production runs in precision optical and small component manufacturing. The Engis 432 planetary machine is very flexible, lapping most precision optics and advanced materials, including sapphire, GaN, SiC and other optical materials, and can be operated in unmanned mode, either timed or thickness-controlled, if required, while still maintaining its accuracy and repeatability. Despite its compact size, it can accommodate components measuring up to 55 mm in diameter, with 18-mm maximum thickness, making it capable of producing a wide range of precision components. The small scale of the lapping surface enables the machine to lap and polish ultrathin pieces that would be impossible on larger dual-face machines. Easy accessibility is provided by a manual lift-off top plate, simplifying the removal of components and minimizing component breakage, contamination of the working zone and the subsequent need for cleaning down or pad replacement. Available accessories include cast iron lap plates, stainless steel plates for pad polishing, composite metal diamond polishing plates, an abrasive lapping slurry pump and a diamond dispensing system.