May 2010Master Bond Inc.Request Info
Master Bond Inc.’s EP21FL is a two-part epoxy resin system
that features low to moderate viscosity. It is suitable for potting, coating and
sealing electronic assemblies and for bonding dissimilar substrates with different
coefficients of expansion. Typical viscosity of Part A (clear) is 4000 cycles per
second and, of Part B (amber), 10,000 cycles per second, at 25 °C. The system produces
strong castings, bonds and seals that are resistant to thermal cycling and shock.
Its bond strength is >1500 lb/sq in., and its tensile strength is >1100 lb/sq
in. The hardened compound is an electrical insulator and is available in 1/2-pint,
pint-, quart-, and 1- and 5-gallon-container kits. It cures at room temperature
and, more quickly, at elevated temperatures, with a 4:1 mix ratio by weight. It
is 100% reactive and contains no solvents or other volatiles.