Oct 2010LPKF Laser & Electronics AGRequest Info
LPKF Laser & Electronics AG has introduced an economical cutting
laser for industrial printed circuit board (PCB) manufacturing. The MicroLine 1000
S is used for depaneling and UV laser cutting of assembled PCBs. The UV laser can
cut substrates located right next to delicate components or circuit paths without
causing any mechanical stress or thermal interference, enabling production of small
subassemblies with high densities. The tool-less method makes any contour possible.
Changes to the cutting paths are made via programming the included software or right
in the CAD software. The system is suitable for cutting break-out tabs and complex
contours with high accuracy. The UV laser makes clean, burr-free cuts in FR4, FR5,
CEM, ceramic, polyimide, polyester and other PCB substrates. It cuts PCBs measuring
up to 250 x 350 mm. With a focus width of 20 μm, the beam cuts very narrow
channels and accommodates tight radii.