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  • Diode-Pumped Lasers
Jan 2011
Photonics Industries International Inc.Request Info
BOHEMIA, N.Y., Jan. 3, 2011 — Photonics Industries has introduced next-generation diode-pumped picosecond lasers which provide high pulse energies.

The RG Series lasers produce >7.5 mJ per pulse at 1 kHz at 1064 nm and more than 10 W at 10 kHz, with <25-ps nominal pulse widths, while maintaining TEM00 mode beam quality and <2% rms pulse-to-pulse instability. Aimed at the industrial market, the lasers are supplied in a compact, industrially reliable package. Higher power versions (30 and 45 W at 1 MHz) as well as harmonic output wavelengths, such as 532, 355, 266 and 213 nm, are also available.

Repetition rates for the infrared, green and ultraviolet lasers range from single shot to 500 kHz. Features include M2 beam quality of <1.3, typical, closed-loop chilled operation, improved micromachining quality with less dross, less heat affected zone than conventional nanosecond diode-pumped solid-state lasers produce, and improved cut quality and throughput for medical uses. Applications include stereolithography, and metal welding, cutting and deburring.

The lasers have been used to demonstrate round and square hole drilling cut in 0.5-mm-thick “Gorilla” glass. The high pulse energy allows the material to be punched rather than trepanned. In addition to glass, the lasers also can be used on a variety of other materials, such as metals and ceramics.

The higher pulse energy pico pulses (e.g., 5 mJ in the green at 1 kHz) enable the more precise/longer-range lidar distance measurements needed for next-generation satellite laser ranging systems.


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The process of forming a lens to a given pattern, or of cutting a piece of glass along the line of scratch.
A method of creating real three-dimensional models by using lasers driven by CAD software. In contrast to the normal practice of removing material, this process polymerizes a liquid to quickly produce shapes that are untouched by human hands or cutting tools. Also known as three-dimensional imaging and three-dimensional modeling.  
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