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Thermal Interface Materials

Photonics Spectra
Jan 2011
MH&W International Corp., Thermal Products Div.Request Info
 
MH&W International Corp. offers U 90 silicone-free thermal interface materials with a new light-tack adhesive for high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads and for facilitating their positioning between components and heat sinks. The Keratherm U 90 is a ceramic-filled polyurethane film with thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 K·in.2/W. A lower-cost version, Keratherm U 80, also silicone-free, provides 1.8 W/mK of thermal conductivity and 0.11 K·in.2/W of thermal impedance. Typical applications for the materials include medical devices, laser equipment, LED lighting, solar energy, disk drives and automotive electronics.


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GLOSSARY
heat sink
A series of flanges or other conducting surfaces, usually metal, attached to an electronic device to transmit and dissipate heat that might damage internal circuitry.
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