Mar 2011Master Bond Inc.Request Info
HACKENSACK, N.J., March 29, 2011 — For demanding applications where highly flexible, impact-resistant bonds are required, Master Bond Inc. has developed Polymer System EP37-3FLF. This optically clear, two-component epoxy exhibits good resistance to cryogenic temperatures and severe thermal cycling. Its low exotherm also makes it a good potting, encapsulating and casting system, especially where wider cross-section thicknesses are specified. Its combination of properties allows it to cure without stressing delicate electronic components.
Serviceable over the range of 4 K to 250 °F, the epoxy cures at room temperature in two to three days, or faster at elevated temperatures. It offers a convenient, noncritical 1:1 mix ratio by weight or volume, and a low mixed viscosity of 1400 to 1500 cycles per second. Users can work with a 100-g mass of the adhesive at room temperature for up to 90 min.
It has a bond shear strength exceeding 2000 lb/sq in. and a T-peel strength of 25 lb/linear in. The epoxy offers an elongation of 180% and good electrical insulation properties with a volume resistivity of 1 × 1014 ohm-cm. It bonds well to a variety of substrates, including metals, glass, ceramics, rubber and many plastics, and is widely used in the optical, electrical, electronic, computer and OEM industries.
The epoxy is sold in pint, quart, gallon and 5-gallon container kits and has a 6-month shelf life if unopened and stored at room temperature.