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  • Comet L3D 5M
Jan 2012
Steinbichler Optotechnik GmbHRequest Info
NEUBEUERN, Germany, Jan. 4, 2012 — Steinbichler Optotechnik GmbH has unveiled the 5-megapixel Comet L3D 5M sensor. The company says that, in comparison with the basic model, Comet L3D, the 5M offers improved camera resolution for a higher level of surface detail.

Even highly structured components can be captured in great detail. Maximum measuring field size is 500 mm. The sensor has a newly developed pulsed operation adapted to the LED, which provides for higher light intensity.

The Comet L3D 5M opens up a new dimension of efficient 3-D data acquisition with its innovative LED lighting technology. The portable device does this easily, quickly and precisely. It represents an entry-level solution for operators who would like to use the wide range of optic measuring technologies without compromising technology, service or data quality.

It also is suitable for use in challenging applications, such as quality control. The robust construction and the dustproof optical components allow the device to be used under industrial conditions, and the compact dimensions and low weight allow the user to employ conventional accessories such as a camera tripod to position the sensor.

Blue LED technology provides fast recording of up to 5-megapixel measuring points. In the case of components with many features, this procedure is faster than measuring with conventional tactile systems. The contactless measuring principle is an advantage, particularly when measuring delicate objects such as those made from plastic or foam material. The low working distance ensures problem-free work, even in confined spaces. The sensor housing uses proprietary single camera technology. The intelligent software concept enables integration with photogrammetric measuring procedures to digitize large objects.

Besides quality control and inspection, particularly of small and medium-size plastic and metal parts, the 3-D sensor is suitable for actual/target comparison of measuring data for the CAD record; for tool and mold manufacture; for tool reconstruction; for scanned data to generate milling paths; for recording of data after tool release; for scanning design models for CAD processing and documentation; for recording 3-D data for rapid prototyping procedures, reverse engineering and 3-D scanning; and for recording historical art objects for archaeology.


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