HILLSBORO, Ore., July 2, 2013 — FEI’s Helios NanoLab 660 DualBeam system provides scanning electron microscopy imaging in combination with focused ion beam milling for materials science research. Applications include investigating the structure and function of materials at the nanoscale, creating prototypes of micro- and nanoelectromechanical systems, and preparing ultrathin samples for atomic-scale imaging and analysis in a transmission electron microscope. The device uses proprietary electron optical and detector technologies to deliver subnanometer imaging resolution with high signal collection efficiency and high contrast over a 0.5- to 30-kV range of accelerating voltages. It is suitable for high-resolution imaging of surfaces, sections or volumes in a variety of materials, especially soft or delicate samples such as carbon nanotubes, polymers, ceramics and catalysts. The company says that its performance at low accelerating voltages reduces beam damage and improves sensitivity to surface detail.