Nov 2014Ultratech Inc.
SAN JOSE, Calif., Nov. 18, 2014 — A new optical in-line inspection system from Ultratech Inc. provides 3-D topographical information for producers of semiconductor wafers.
The Superfast 4G uses proprietary coherent gradient-sensing technology to perform direct, front-side 3-D measurement for patterned wafers, with a throughput of up to 125 wafers per hour.
Its open architecture is intended to improve laser lithography performance.
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