BERLIN, Dec. 10, 2015 — VI Systems GmbH offers high-speed electrical and optical testing of wafers early in the manufacturing process using a semiautomatic wafer probing station. The system reduces manufacturing costs by eliminating out-of-specification wafers before they have been cut and packaged to improve yield. It also offers high-speed characterization at the wafer level. Test parameters include optical output power and optical spectrum. Electrical parameters include operation voltage, bias voltage, drive current and dark current. In addition, a high-frequency characterization test of up to 38 GHz can be performed including digital transmission experiments of up to 64 Gb/s.