GILBERT, Ariz., March 15, 2016 — Finetech USA’s FINEPLACER femto 2 die-bonding platform is designed for advanced packaging and bonding in automated precision manufacturing, with a focus on high yield. With a placement accuracy of ± 0.5 μm at three sigma and maximum process flexibility, the machine supports a wide range of applications at chip and wafer level. The prototype-to-production system accommodates applications that migrate from process and product development to automated low-volume production environments. The platform accommodates optoelectronics, semiconductors, silicon photonics, medical engineering, sensor production and R&D. High-quality dispensing options allow lines, dots and patterns, as well as micro dipping solutions for smallest components and contact areas.