Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn

  • Microassembly Platform
Mar 2016
FinetechRequest Info
GILBERT, Ariz., March 15, 2016 — Microassembly PlatformFinetech USA’s FINEPLACER femto 2 die-bonding platform is designed for advanced packaging and bonding in automated precision manufacturing, with a focus on high yield.

With a placement accuracy of ± 0.5 μm at three sigma and maximum process flexibility, the machine supports a wide range of applications at chip and wafer level. The prototype-to-production system accommodates applications that migrate from process and product development to automated low-volume production environments.

The platform accommodates optoelectronics, semiconductors, silicon photonics, medical engineering, sensor production and R&D. High-quality dispensing options allow lines, dots and patterns, as well as micro dipping solutions for smallest components and contact areas.


* Message:
(requirements, questions for supplier)
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address 2:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required
A sub-field of photonics that pertains to an electronic device that responds to optical power, emits or modifies optical radiation, or utilizes optical radiation for its internal operation. Any device that functions as an electrical-to-optical or optical-to-electrical transducer. Electro-optic often is used erroneously as a synonym.
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2016 Photonics Media
x We deliver – right to your inbox. Subscribe FREE to our newsletters.