Logitech Ltd. has unveiled a wire saw that slices samples up to 4 in. square. The AWS1, designed for use in photonics, semiconductor and geological applications, can slice gallium arsenide, silicon and lithium niobate, as well as ceramics, cements and many polycrystalline materials. Users can move the sample, viewing its position on a digital readout that has a resolution of 10 µm, and can adjust the angle of the cut with a cross-slide. The integrated abrasive system produces a lapped finish.