Request InfoLogitech Ltd.Logitech Ltd. has unveiled a wire saw that slices samples up to 4 in. square. The AWS1, designed for use in photonics, semiconductor and geological applications, can slice gallium arsenide, silicon and lithium niobate, as well as ceramics, cements and many polycrystalline materials. Users can move the sample, viewing its position on a digital readout that has a resolution of 10 µm, and can adjust the angle of the cut with a cross-slide. The integrated abrasive system produces a lapped finish.See full productRelated content from Photonics MediaWEBINARSPhotonics.com 7/20/2023Motorized and Calibrated Lenses for Machine Vision ApplicationsMany applications have benefited from motorized varifocal lenses that allow automatic or remote adjustment of focus distance and field of view. Applications may need to change the focal length or...Photonics.com 1/12/2023A Proven, Portable, and PIC-Based Methodology for Cultivating a Next-Generation WorkforceWith the passage of the CHIPS and Science Act and growing demand for photonic integrated circuit technology, the semiconductor industry is once again gaining momentum. But even as the U.S. rebuilds...Photonics.com 1/18/2018Fiberguide RARe Motheye Fiber: Random Anti-Reflective (RARe) Nanostructures on Optical Fibers as Replacement for AR CoatingsAnti-reflective (AR) coatings are now entering their second century and have remained virtually unchanged throughout their life. As power level and wavelength range requirements continue to increase,...Photonics.com 3/27/2024Precision Planning: Simplified Laser Scanning with Predictive SoftwareConventional controllers for laser scan systems do not allow to predict the actual path of the laser beam on the work piece. A tedious process of testing different parameters and delay settings...