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THERMALl-CURE EPOXY

Photonics Spectra
Dec 2000
Electronic Materials Inc.Request Info
 
The Emcast 4180 single-component, thermal-cure epoxy system for electronic assembly has been added to Electronic Materials Inc.'s line. It has low viscosity and a fast cure schedule at elevated temperatures, and it adheres well to a variety of substrates. The epoxy is initiated upon exposure to temperatures above 100 °C, but some applications may require different starting points depending on size, time and temperature. It is cured in a convection oven and should not be used for casting masses larger than 25 g.


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