LASER DIODE BONDER
Feb 2001Semiconductor Equipment Corp.Request Info
The model 860 Omni laser diode bonder is suitable for use with vertical-cavity surface-emitting lasers, edge-emitting laser diodes and laser bars and arrays. Semiconductor Equipment Corp. says it aligns and attaches die at a throughput rate of 140 per hour with an accuracy of ±5 µm. The platform has an extend-retract cube beamsplitter viewing system with illuminators, a stereozoom microscope on a pivoting mount and servomotor-driven Z motion with closed-loop temperature control.