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ENGRAVING, CUTTING

Photonics Spectra
May 2001
Universal Laser SystemsRequest Info
 
lCuttingUniversal Laser Systems Inc. has introduced a laser platform that employs two side-by-side CO2 laser beams for simultaneous multiline engraving or combined beam cutting. The system features the X2-SuperSpeed, a 32 x 18-in. work area that is cross-platform-compatible with the company's air-cooled laser cartridges. The system features an integrated computer-controlled beam combiner for user-selectable laser power density and 25- to 100-W rapid reconfiguration capability. The freestanding unit also features a motorized Z axis, autofocus and an X-Y beam-positioning system.


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