Hybrid Photoresist Helps Meet Demand for Smaller Chips
UPTON, N.Y., Nov. 14, 2023 — To achieve performance gains in microelectronics, semiconductor size continues to shrink, with feature sizes now in the sub-10-nm range. The challenges associated with the extreme downscaling of semiconductors have led to the adoption of a powerful semiconductor fabrication method: extreme-ultraviolet (EUV) lithography. EUV lithography requires photoresists that provide high sensitivity, resolution, and etch selectivity. To meet this need, researchers at the Center for Functional