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Suss MicroTec Products
ELP300 Gen2 Excimer Laser Stepper
GARCHING, Germany, March 4, 2014 — Suss MicroTec has launched the ELP300 Gen2, an excimer laser stepper that enables the creation of smaller via sizes (<5 µm) and decreased via pitch for advanced packaging and 3-D processing applications. Using excimer laser ablation allows alternative organic polymers that contain enhanced mechanical, physical, thermal and chemical properties to be used to lower cure temperatures and coefficient thermal expansion (CTE) stresses. Configured for 200- and 300-mm wafers, the...
SUSS MicroTec SE
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MO Exposure Optics
GARCHING, Germany, June 16, 2009 – Suss MicroTec Lithography GmbH has launched an illumination system with patent-pending high-resolution MO exposure optics designed for all generations of the company’s manual and automatic mask aligners. The new optical system is based on microlens...
SUSS MicroTec SE
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iVista Digital Microscope
GARCHING, Germany, July 23, 2007 -- Suss MicroTec AG said its new iVista high-resolution digital microscope significantly improves the productivity of operators and engineers -- who are increasingly faced with rapid device design changes that result in instruments with extremely...
SUSS MicroTec SE
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DSM200 MEMS Metrology System
GARCHING, Germany, May 3, 2007 -- With the DSM200, microelectronics and test systems maker Suss MicroTec AG said it has developed an automated metrology system for all emerging front-to-back alignment applications. According to the company, the cassette-cassette, front-to-back...
SUSS MicroTec SE
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M-Lock Wafer Bonder
WATERBURY CENTER, Vt., July 24, 2006 -- Suss MicroTec, a supplier of precision manufacturing and test equipment to the semiconductor industry, has introduced M-Lock, a wafer-bonding system designed for high vacuum applications. In what the company said is an industry-first, this...
SUSS MicroTec Inc.
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May 2024
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Rare-Earth Doped Fibers Deliver Critical Elements to Dynamic Systems
Photonics Spectra
, May 2024
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Photonics Spectra
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