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clear Products
Diamonex ClearShield
WINDSOR, England, June 16, 2014 — With an extremely clear appearance and hardness of more than 20 gigapascals, the Diamonex ClearShield scratch and wear-resistant window coating from Morgan Advanced Materials was developed to meet the electronics market’s transition to optical...
Morgan Advanced Materials plc
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Epoxy System
May 10, 2010 — Master Bond Inc.’s EP21FL is a two-part epoxy resin system that features low to moderate viscosity. It is suitable for potting, coating and sealing electronic assemblies and for bonding dissimilar substrates with different coefficients of...
Master Bond Inc.
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IMSEAL-800 Epoxy Resin
EAST PROVIDENCE, R.I., April 1, 2010 — IMSEAL-800, a high-strength epoxy resin, seals visible porosity deep below the surface in castings and other metal parts, completely and permanently filling blowholes, cracks and other defects where welding or brazing would be impractical. Available...
IMPCO Inc.
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EP21FL Epoxy System
HACKENSACK, N.J., March 15, 2010 – Master Bond Inc.’s is a two-part epoxy resin system that features low to moderate viscosity. It is suitable for potting, coating and sealing electronic assemblies and for bonding dissimilar substrates with different coefficients of expansion....
Master Bond Inc.
Request info >
Die-Bonding Materials
Feb 28, 2010 — Shin-Etsu Silicones of America has introduced the KER series, a line of silicone die-bond materials that provide advanced encapsulating performance for high-brightness LEDs. The products were developed as a die encapsulation, die-attach adhesive and...
Shin-Etsu Silicones of America
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Epoxy Compound
Sep 1, 2009 — The 20-3001 NC noncrystallizing epoxy potting and encapsulating resin introduced by Epoxies Etc. is a low-viscosity system that forms a bubble-free glasslike finish when cured. Containing no solvents or fillers, it is available in black or clear and...
Epoxies, Etc.
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(6 results found)
May 2024
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