Thermal Imaging Camera
WILSONVILLE, Ore., April 29, 2016 — Flir Systems Inc. has announced the X8000sc series of thermal imaging cameras with lock-in, transient and pulse capabilities to perform advanced inspections such as nondestructive testing or stress mapping that resolve temperature differences as low as 1 mK.
The cameras detect internal defects though target excitation and the observation of thermal differences on a target’s surface. They also detect defects and points of failure in composites, solar cells, bridges and electronics,...
Teledyne FLIR Systems Inc.